R979S Thermoformed panel for radiant floor systems with thin screed R473X221 or Wireless M-Bus data centralization

or Wireless M-Bus data centralization (GE552-W series)

Use key R558 (included) or R558N for the balancing

The management of the HIUs parameters is completely electronic

- R73FPY001: pair of spanners for removing the manifold modules

Fits 1/2” sprinkler head

R979S Thermoformed panel for radiant floor systems with thin screed R473X221 or Wireless M-Bus data centralizationThermoformed panel for radiant floor with thin screed, made of high resistance PPR. Laying pitch: multiples of 50 mm. Standard panels: for 1617 mm pipes. Slim panels: for 12 mm pipes. Dimension standard panels: 800x600 mm (1200x800 mm for R979SY101 and R979SY121). Dimension slim panels: 1200x600 mm. Ideal for renovations. Info THERMAL RESISTANCE R979SY021: 0,19 (mK) W R979SY025: 0,19 (mK) W R979SY121: 0,19 (mK) W For the fixing of R979SY101,