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This Standard can be used as the specification sheet for tape frame upon purchasing
1 — Specification for SECS-II Support for Processing Management
SEMI G87-1108 (Reapproved 0215)
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SEMI MF1390-02 (first SEMI publication)
G08800 - SEMI G88 - Specification for Tape Frame for 450 mm Wafer Revision:SEMI G88-0211 - Superseded This Standard can be usedThe purpose of this Document is to standardize the specifications for 450 mm wafer tape frames used between the dicing process and the die bonding process, and also used for shipping and handling. This Standard is applicable to 450 mm wafer tape frames. This Standard documents the dimensions, characteristics, and measurement methods for 450 mm wafer tape frames. This Standard can be used as the specification sheet for tape frame upon purchasing.
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