G08700 - SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer StdPbc-0611 本測定方法は，Global Flat Panel Display Committeeで技術的に承認されたもので，Japanese

本測定方法は，Global Flat Panel Display Committeeで技術的に承認されたもので，Japanese FPD Materials and Components Committeeが直接責任を負うものである。現版は，2003年4月28日Japanese Regional Standards Committeeにて承認されている。2003年6月にまずwww

This Standard does not define terms which have been defined already in other referenced Standards

consumer가 각각의 목적에 따라 관련된 데이터를 그룹화 하는 메커니즘을 포함한다

SEMI MF1727-1110 (Reapproved 0322)

This Document also provides guidelines for grades of phosphoric etchants for which a need has been identified

G08700 - SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer StdPbc-0611 本測定方法は，Global Flat Panel Display Committeeで技術的に承認されたもので，JapaneseThe purpose of this Document is to standardize the specification of a plastic tape frame, for a 300 mm wafer, which is used between the dicing process and the die bonding process, and for the handling and shipping of wafers. This Specification is applicable to plastic tape frames for 300 mm wafers. This Standard puts in writing the dimensions, mechanical characteristics and measurement method for the 300 mm wafer tape frame. This Standard can be used