Front of Line Assembly Evt-Webinar SEMI C23-0301 (technical revision)

SEMI C23-0301 (technical revision)

• To identify and define key properties of EUV substrates and blanks which should be specified in the purchase order between users and suppliers

This Guide provides an example of the performance of state-of-the-art resins

The technical architecture intentionally limits its scope to only the most fundamental infrastructure requirements

The intention of this Document is to define a set of requirements and features to enable interoperability of load ports and carriers without limiting innovative solutions

Front of Line Assembly Evt-Webinar SEMI C23-0301 (technical revision)Course Description The semiconductor industry provides critical enabling technology for many products and fields and has seen periods of rapid growth. While electronic goods dominate the market, communications, medical devices, and the automotive industry show signs of increased potential. This course provides an overview of front of line packaging assembly, not including interconnect technologies. This course will share key package assembly